<?xml version="1.0" encoding="UTF-8"?><module moduleId="%5" fritzingVersion="%3">
 <version>4</version>
 <author>Fritzing Part-o-matic</author>
 <title>DIP v2 - %1 pins</title>
 <label>IC</label>
 <date>2025-09-01</date>
 <tags>
  <tag>DIP</tag>
  <tag>fritzing core</tag>
  <tag>v2</tag>
 </tags>
 <properties>
  <property name="family">Generic IC v2</property>
  <property name="package">DIP (Dual Inline) [THT] v2</property>
  <property name="pins">%1</property>
  <property name="pin spacing">%6</property>
  <property name="chip label">IC</property>
  <property name="hole size">%4</property>
 <property name='editable pin labels'>true</property>
</properties>
 <taxonomy>part.dip.v2.%1.pins</taxonomy>
 <description>A DIP stand-in part for whatever IC you want. With %1 pins on a %6 dual inline package (DIP) footprint.</description>
 <views>
  <iconView>
   <layers image="icon/generic_dip_v2_icon.svg">
    <layer layerId="icon"/>
   </layers>
  </iconView>
  <breadboardView>
   <layers image="breadboard/generic_ic_dip_v2_%1_%6_bread.svg">
    <layer layerId="breadboard"/>
   </layers>
  </breadboardView>
  <schematicView>
   <layers image="schematic/generic_ic_dip_v2_%1_schem.svg">
    <layer layerId="schematic"/>
   </layers>
  </schematicView>
  <pcbView>
   <layers image="pcb/%5_pcb.svg">
    <layer layerId="silkscreen"/>
    <layer layerId="copper0"/>
   <layer layerId="copper1"/></layers>
  </pcbView>
 </views>
 <connectors>
%2
 </connectors>
</module>
